Code Snippets
curl "https://financialdata.net/api/v1/short-interest?identifier=KLAC&key=API_KEY"import requests
url = 'https://financialdata.net/api/v1/short-interest?identifier=KLAC&key=API_KEY'
response = requests.get(url)
print(response.json())
const url = 'https://financialdata.net/api/v1/short-interest?identifier=KLAC&key=API_KEY';
const response = await fetch(url);
const data = await response.json();
console.log(data);
Sample Response
[
{
"trading_symbol": "KLAC",
"title_of_security": "KLA Corporation Common Stock",
"market_code": "NNM",
"settlement_date": "2026-09-30",
"shorted_securities": 24261297,
"previous_shorted_securities": 23554039,
"change_in_shorted_securities": 707258,
"percentage_change_in_shorted_securities": 3.0,
"average_daily_volume": 9194438,
"days_to_cover": 2.64,
"is_stock_split": false
},
...
]Query Parameters
| Name | Type | Description |
|---|---|---|
| identifier | string | The trading symbol for a security. (e.g., MSFT) |
| offset | integer | (Optional) The initial position of the record subset, which indicates how many records to skip. Defaults to 0. (e.g., 100) |
| format | string | (Optional) The format of the returned data, either JSON or CSV. Defaults to JSON. (e.g., json, csv) |
Endpoint Overview
Short interest represents the number of shares of a company that are currently sold short and have not yet been covered. The short interest ratio, also known as days to cover, represents the number of days it would take for all short-sold shares to be covered or repurchased in the market. Our API provides short interest data for over 15,000 securities. There is a limit of 100 records per API call.
Company Profile
KLA CORP
NASDAQ: KLAC- Market Cap:$159.30B
- ISIN:US4824801009
- Fiscal Year End:06/30
- CEO:Richard P. Wallace
- Employees:15000
KLA Corporation is an American company based in Milpitas, California that makes wafer fab equipment. It supplies process control and yield management systems for the semiconductor industry and other related nanoelectronics industries. The company's products and services are intended for all phases of wafer, reticle, integrated circuit (IC) and packaging production, from research and development to final volume manufacturing.