Code Snippets
curl "https://financialdata.net/api/v1/earnings-releases?identifier=LRCX&key=API_KEY"import requests
url = 'https://financialdata.net/api/v1/earnings-releases?identifier=LRCX&key=API_KEY'
response = requests.get(url)
print(response.json())
const url = 'https://financialdata.net/api/v1/earnings-releases?identifier=LRCX&key=API_KEY';
const response = await fetch(url);
const data = await response.json();
console.log(data);
Sample Response
[
{
"trading_symbol": "LRCX",
"central_index_key": "0000707549",
"registrant_name": "LAM RESEARCH CORP",
"market_cap": 337166447310.0,
"fiscal_quarter_end_date": "2026-06",
"earnings_per_share": 1.33,
"earnings_per_share_forecast": 1.69,
"percentage_surprise": null,
"number_of_forecasts": 9,
"conference_call_time": null
},
...
]Query Parameters
| Name | Type | Description |
|---|---|---|
| identifier | string | The trading symbol for a security, or the central index key (CIK). The latter is assigned to the entity by the United States Securities and Exchange Commission. (e.g., MSFT, 0000789019) |
| format | string | (Optional) The format of the returned data, either JSON or CSV. Defaults to JSON. (e.g., json, csv) |
Endpoint Overview
An earnings release is an official public announcement revealing a company's profitability during a specific time period. It affects the share price, which rises or falls in response to the company's performance. Our API provides extensive information on the release, including actual and predicted earnings, release timing, and so on.
Company Profile
LAM RESEARCH CORP
NASDAQ: LRCX- Market Cap:$178.31B
- ISIN:US5128073062
- Fiscal Year End:06/28
- CEO:Tim Archer
- Employees:23300
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).